Flex PCB SMT Assembly provides excellent electrical performance for smaller and higher-density installation designs, as well as helping to reduce assembly steps and enhance reliability. Flexible circuit boards are the only solution to meet the miniaturization and mobility requirements of electronics. It can be bent, wound, and folded freely, can withstand millions of times of dynamic bending without damaging the wire, can be arranged arbitrarily according to the requirements of spatial layout, and can be moved and expanded arbitrarily in three-dimensional space to achieve the integration of component assembly and wire connection. A flexible circuit board can greatly reduce the volume and weight of electronic products and is suitable for the development of electronic products in the direction of high density, miniaturization, and high reliability.
The difference between the substrate, covering film and PI reinforcement of flexible board
FPC flexible circuit board is a kind of flexible printed circuit board made of PI
polyimide or polyester film as the substrate with high reliability and excellent flexibility, with the characteristics of high wiring density, light weight, thin thickness, and good bendability.
PI substrate: For FPC flexible circuit board substrates, there are two types of substrates: adhesive substrates and non-adhesive substrates. Whether it is a gel-based or non-glue substrate, PI polyimide is essential.
PI Covering Film: Its main function is to insulate circuits.
PI reinforcement: It is often applied to the area on the back of the FPC gold finger. PI stiffeners are used to increase the thickness and stiffness of the fingers for easy insertion and removal.
The difference between the thickness of the substrate and the covering film of the FPC flexible circuit board is:
PI substrate: For PI in the substrate, 1/2 mil and 1 mil are very common, and their thickness can even reach 4 mil and 5 mil (DuPont glue-free PI material).
PI Cover Film: There are two options for the thickness of PI on the cover film: 1/2 mil or 1 mil.
PI reinforcement: The thickness of PI reinforcement is available in a variety of options according to customer needs, such as 0.075 mm, 0.1 mm, 0.125 mm, 0.15 mm, 0.175 mm, 0.2 mm, 0.225 mm, 0.25 mm, etc.
The difference between the substrate and the covering film of the FPC flexible circuit board in the colour selection is:
PI substrate: no colour options.
PI Covering Film: PI Covering Film is available in three colours: yellow, white, and black.
PI reinforcement : varies with thickness; the thicker the colour, the darker. For example, a 0.075 mm PI reinforcement looks brown, and a 0.25 mm PI reinforcement is closer to black.
The development prospect of FPC flexible board
The application fields of FPC flexible boards can be divided into three categories: smartphones, wearable devices, and automotive electronics.
The application in smartphones covers battery modules, display modules, touch modules, camera FPCs, connection modules, etc., and a smartphone needs to be equipped with 10–15 FPC soft boards. With the commercial use of 5G, the development of smartphones for miniaturization and large screens, and the rise of folding-screen mobile phones, etc., will increase the use of FPC flexible boards. The demand for FPC flexible boards in the smartphone field is on the rise.
In addition to mobile phones, the automotive electronics market is also the main battlefield of FPC, and automotive control systems, such as dashboard displays, air quality, audio, displays, sensors, etc., require high signal transmission capacity and high reliability, so FPC has begun to show its advantages.
With the emergence of new electronic products, the market and use of FPC flexible boards are also expanding, and the upgrading of different types of electronic products will bring more considerable development prospects than the traditional market.
Advantages and disadvantages of FPC
The advantages of multi-layer circuit boards are: high assembly density, small size, light weight; because of high-density assembly, the connection between components (including parts) is reduced, thereby increasing reliability; it can increase the wiring layer and then increase the design flexibility; it can also constitute the impedance of the circuit; it can form a certain high-speed transmission circuit; it can set the circuit; it has an electromagnetic shielding layer; it can also install a metal core layer to meet special thermal insulation and other functions and requirements; easy installation; and high reliability.
Disadvantages of multilayer PCB board (unqualified): high cost, long cycle, need for high reliability inspection methods. Multilayer printed circuits are the products of electronic technology and are multi-function, high-speed, small volume, and large capacity. With the development of electronic technology, especially the wide application of large-scale and ultra-large-scale integrated circuits, the fast, high-precision, and high-number change direction of multilayer printed circuits with high density has fine lines.
Group Profile
ZHUHE is a leading manufacturer and assembler of flexible PCBS. With over 10 years of experience as a PCB supplier, we are known for our expertise in the manufacture and assembly of flexible PCBS, including flexible PCB prototypes, small batch, medium batch, and high batch flexible PCBS. We also provide a one-stop flexible PCB assembly service for customers requiring affordable and fast turnaround PCBA services.
In recent years, through the integration and layout of the industrial chain, its products and technologies have been diversified, including semiconductor devices, pulse motors, high-frequency transformers Inductors, etc., mainly focusing on high-speed data transmission and communication, automotive electronics, medical electronics, industrial control products, energy-efficient power supply technology and other fields.
We provide customers with one-stop service!
We are the source manufacturer with -10 years of focus on manufacturing high-quality circuit boards and efficient and satisfactory services.
We have a professional team -we have rich R & D / production experience in FPC/PCBA/IC/ new energy and other fields.
We have considerate service -we provide considerate service from sample design to mass production.
We have sophisticated Intelligent Manufacturing -we have highly intelligent equipment and efficient teamwork to provide you with the best cost solution.
Q: What are the application scenarios of flexible circuit boards?
A: Flexible circuit boards are mainly used in various mobile intelligent terminal equipment, computer peripherals, automobiles, aerospace and other industries. For example: mobile phones, laptops, tablets, LED screens, car DVDs, car dashboards, etc. Their main feature is that they have multi-directional bending, can adapt to a wide variety of curved surfaces, and are more ergonomic for use.
Q: What is the difference between a flexible circuit board and a rigid circuit board?
A: The biggest difference between flexible circuit board and rigid circuit board is that flexible circuit board uses flexible materials, which can achieve bending in three-dimensional space, and can be made into curved surfaces or even bending, while rigid circuit boards cannot. Due to the special nature of flexible circuit boards, special moulding processing is also required, and can be designed according to the needs of various product structures. On the other hand, because flexible circuit boards use thinner, softer materials, they are relatively thinner and lighter, making it easier to accommodate a wide range of bends and compressions.
Q: What are the advantages and disadvantages of flexible circuit boards?
A: The flexible circuit board has many obvious advantages: firstly, it can greatly save space and save the user's space cost; Secondly, it can adapt to various shapes, providing a good solution for product designers and engineers, in addition, the reliability of flexible circuit boards has been greatly improved, the noise temperature coefficient is small, the transmission rate is high, and the signal interference and other problems can be effectively controlled. However, there are certain disadvantages, such as complex production and high cost, the need for professional production personnel to carry out production, and the need for multiprocess processing and assembly.
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